Home > Products > Wafer Processing Services

Wafer Processing Services

Wafer Processing Services

Goetsu can provide the following OEM services: ■ SIC reverse throw regeneration
■ Cutting, lapping, polishing and cleaning of SAMO/Ga

Goetsu can provide the following wafer processing services:

■   Reclaim Wafer for SiC/GaN
■   Slicing, lapping, polishing and cleaning of SAM/GaN substrate

Copyright © 2001-2050 Goetsu Semiconductor Wuxi Co., Ltd. All rights reserved
苏公网安备 32021402002071号